Email: raghavender.thirmandas@gmail.com                                             Phone: 361.522.7624

 

OBJECTIVE

Self-motivated, young professional actively seeking a challenging full time position to pursue excellence in the fields of Electrical/Hardware Engineering

 

SUMMARY

§    Recent college graduate with an overall experience of 3 years in engineering.

§    1 year experience as a Computer Hardware Lab In charge at Undergraduate School.

§    Excellent Circuit analysis skill and problem solving capability.

§    Good understanding of Flight Control Systems and Actuation Systems (HSCS).

§    Good exposure to Electronics Testing Equipment, Power Distribution Units and AC to Dc converters.

§    Working knowledge on System Requirements including Hardware and Software.

§    Capable of understanding DOORS standards for Hardware Development.

§    Good conceptual knowledge of Microprocessors, Analog & Digital Electronics, RF and Circuits.

§    Technically good at Computer Architecture concepts including processor, bus, main memory, cache, internal registers and pipelining.

§    Proficient in Simulation of verilog code using Modelsim and synthesizing the code using Xilinx Ise tools.

§    Strong commitment to work and great passion for Integrated Circuits.

§    Good communication, interpersonal and presentation skills.

§    Excellent work ethics, challenging and good team player.

§    Quick learner will adapt new technologies and third party products.

 

EDUCATION

 

M.S. Electrical & Electronics Engineering                                              Graduated: May 2013                                                                          

Texas A&M University – Kingsville                                                                                                                                              GPA: 3.75/4.0

 

B.S. Electronics and Communications Engineering                                Graduated: May 2009              

Jawaharlal Nehru Technological University (JNTU), India                                                          GPA: 3.7/4.0

 

PROFESSIONAL EXPERIENCE

 

Rockwell Collins (Cedar rapids, IOWA)                                               June 2014 – Present

Role: Electrical Engineer

Responsibilities:

§    Working as a Cognizant Engineer for Flight Control Computer FCC- 730 used in Boeing 737 flights and holding ownership of the product.

§    Working on OEM’s, Boeing removals, Airline returns.

§    Troubleshooting circuit cards including Power, Analog, Digital, and Rudder and Warn Engage cards.

§    Finding root cause for the failures in the circuits manually and by doing NVM analysis using software tools (company specific).

§    Hands-on experience in using ATE and System pallets for aerospace applications i.e especially LRU’s.

§    Circuit Design enhancement by analyzing electrical parameters, replacing vendor supplied components and analysis on application of components.

§    Working with cross functional teams including Software, Systems, Manufacturing Engineers to minimize No Faults Found (NFF) on the Boeing Products.

§    Strong understanding of BOM, Schematics, Assembly’s, part numbers and Industry standards.

§    Solving factory related issues with this product FCC-730 and strong knowledge of semiconductor components.

§    Next step incudes working on hardware requirements.

 

Rockwell Collins (Cedar rapids, IOWA)                                               Nov 2013 – June 2014

Role: Hardware Systems Engineer

Responsibilities:

§    Working on the development of Horizontal stabilizer Control System (HSCS) for Embraer (Second generation) E2 190/195 JETS

§    Captured lab requirements and analyzed the requirements as per the customer need

§    Drawing electrical/electronic engineering assembly layouts using MS Visio

§    Performed basic engineering analysis under general supervision of senior engineers in Flight Control Systems department

§    Working on the documentation of Horizontal Stabilization Control System Integration Laboratory (HSCSIL) containing Lab development, interconnect definition/management, hardware integration, lab infrastructure, and system test

§    Contributing to the detailed requirements and Systems Integration for FBW flight control product development

§    Concentrated on the signal names, types, signal assignments and connections to the ARINC429 card, Relay card

§    Developed a hardware design for the interconnection of signals (Personality Module), an I/O signal network which holds interconnections from the components in the HSCSIL Electronics Rack including Break-Out panel, Fault Injection modules, I/O chassis etc.

§    Meeting with the senior engineers on a regular basis and perform other duties as assigned.

§    Worked on Acceptance, validation and verification, Integration with other systems.

 

MobileComm Professional , Inc(Dallas, Texas)                               January 2013 - May 2013      

Role: RF Associate Intern

Responsibilities:

§    Worked as an RF associate engineer and team member for 4G LTE launch project in DC for T-Mobile (Baltimore, Maryland)

§    Data Collection and functionality testing over GSM

§    E911 Sector Testing insuring accurate phone number, Site Address

§    Manual call testing to assure proper call connection (mobile to mobile, mobile to land line)

§    All testing done on Alpha, Beta and Gamma Sectors for each BTS

§    Coordination with RF Engineers serving to optimization network, reduce dropped calls, reduce interference levels and utilizing drive testing equipment (TEMS mobile kit)

 

Texas A & M UNIVERSITY Kingsville                                           January 2012– July 2012

Role: Student Assistant and Teaching assistant

Responsibilities:

§    Assisted students in solving signal transformations with the given assignments by the Professor and chair of Electrical Engineering

§    Helped professor in sorting out the topics and searching IEEE journal papers on signal processing and wireless communications

§    Collected information from the standard books, journals and theoretically analyzed the information with the help of higher order integration in S (Laplace) domain

 

HONORS AND ACTIVITIES

Graduate Merit Scholarship                                                                      August 2012- May 2013

Graduate Student Electrical Engineering Scholarship                             May 2012- August 2012

 

PROFESSIONAL ORGANIZATIONS

IEEE – Institute of Electrical and Electronics Engineers

 

 

SKILLS

Programming: C, Verilog, C++, 8086 assembly

Database: SQL

Tools: Modelsim, Xilinx, Visual C++, Keil, Matlab, DOORS, Subversion, PSpice

Microsoft Office: Word, Excel, Access, PowerPoint, Visio

Lab Equipment: Function generators, multi-meters, Oscilloscopes, PCB